-
2023.06M SQUARE
Brand open day -
2023.05
LPDDR5X
6nm Tapeout
-
2023.02
LPDDR4X
12nm Tapeout -
2023.01
M SQUARE
joined CCITA
-
2023.01
M SQUARE (Chengdu)
R&D center
-
2022.12
Completed
A round of financing
-
2022.09
M SQUARE, Enflame and
the other 10 partners established
"Data Center XPU Alliance"
-
2022.08
Award:
Innovative IP Company of the Year
-
2022.08
PCIe 4.0
Product Release
-
2022.06
USB 3.2 12nm
Tapeout Success -
2022.06
M SQUARE signed MOU
with leading AI chip company Enflame.
-
2022.06
M SQUARE
joined USB-IF
-
2022.04
M SQUARE
joined UCIe
-
2022.03
The success of
the first customer tapeout
-
2022.02
PCIe 4.0 12nm
Tapeout Success -
2022.01
M SQUARE (Beijing)
subsidiary incorporated
-
2022.01
M SQUARE
joined PCI-SIG
-
2021.12
Delivered IP
to our first customer
-
2021.12
M SQUARE
joined MIPI Alliance
-
2021.11
Completed
pre-A round of financing
-
2021.09
M SQUARE(Hefei)
subsidiary incorporated
-
2021.08
M SQUARE(Shanghai)
headquarters incorporated
Contact Us
marcom@m2ipm2.com
hr@m2ipm2.com
6th Floor, Building 6-2, No. 519 Shenchang Rd, Minhang, Shanghai, 201107
Links
Follow Us
marcom@m2ipm2.com
hr@m2ipm2.com
6th Floor, Building 6-2, No. 519 Shenchang Rd,
Minhang, Shanghai, 201107
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